High-Performance Computing for the Electromagnetic Modeling and Simulation of Interconnects

The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In recent years, packaging has become a critical area in the design of high-speed communication systems and fast computers, and the importance of the software support for their development has increased accordingly. Throughout this project, our efforts have focused on the development of modeling and simulation techniques and algorithms that permit the fast computation of the electrical parameters of interconnects and the efficient simulation of their electrical performance

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House'

The IEEE EPS Packaging Benchmark Suite

The current state of the Packaging Benchmark Suite being developed by the IEEE EPS technical committee on electrical design, modeling, and simulation (TC-EDMS) is reviewed. The history and goals of the effort to establish the Suite, the key requirements from benchmarks that can support advances in simulation tools and computational methods, and the process being followed by the volunteer committee formed by the authors to produce the Suite are described. The first three benchmarks in the Suite and the steps that were taken to elevate them from potential candidates to effective benchmarks are presented